On September 6, the 5th China International New Materials Industry Expo Summit, co-sponsored by the Ministry of Industry and Information Technology and the Heilongjiang Provincial Government, was held in Harbin. Wang Jiangping, deputy director of the Ministry of Industry and Information Technology, pointed out in his speech that the development of new materials in China has lagged behind the development of the manufacturing industry, and the phenomenon of manufacturing “waiting for the pot” is very prominent.

Wang Jiangping said that the current new materials have become an important field of competition in various countries in the world. China is in a critical period of industrial transformation and upgrading. Many equipment and terminal applications are inseparable from new materials. For example, high-alloy functional coating materials are the key to aviation engines. Support, carbon fiber composite materials, etc. are the materials of high-end aircraft high-end equipment, and the new battery materials determine the endurance and fast-charge aging of new energy vehicles. However, the reality is that the development of new materials in China has lagged behind the development of the manufacturing industry. The phenomenon of “waiting for the pot” in the manufacturing industry is very prominent. In some areas, short-boards and gaps have emerged. New materials have become a short-board that restricts the transformation and upgrading of the manufacturing industry. .

He stressed that the next step is to strengthen the top-level design, coordinate on policy, and increase efforts on capital investment. First, to strengthen policy co-ordination, it is possible to establish a relevant overall coordination mechanism within the region, and focus on key products and enterprises of new materials, especially to focus on integrated circuit materials. The second is to increase the promotion and application, continue to expand insurance pilots, carry out relevant major policy research, and introduce relevant policies to promote the early application of new materials. The third is to promote the construction of key products, continue to promote production and application platforms, and expand to new energy, automotive materials, integrated electronic materials.

Academician Gan Yong, former vice president of the Chinese Academy of Engineering, pointed out that China's integrated circuit design, manufacturing, and packaging are subject to restrictions on major equipment and key materials, and there is a large gap between the advanced level and foreign countries. Although the chip is small, it is the "national weapon", but the current core technology is still heavily dependent on foreign countries. Among them, many related new materials are prominent shortcomings. He believes that accelerating innovation breakthroughs in the field of new materials requires military and civilian three-in-one research and development integration, integration of materials and components research and development, integration of research and development, design, production and application, and integration of research and development projects with national industrial innovation centers.